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Hino Truck FG17 and FG19 Workshop Manual download

1) Safety & preparation
- Isolate power (battery negative disconnected) and follow ESD precautions (ground strap) — TCM electronics are static-sensitive and can be destroyed by incorrect handling.
- Tools: OBD/scan tool with transmission params & freeze frame, multimeter, oscilloscope, bench DC supply (adjustable ~12–14V), current-limited supply or series resistor, soldering iron with temperature control, hot air rework station, magnifier, component tester, wiring diagrams/pinouts, service manual for connector pin assignments.
- Why: prevents secondary damage, allows safe bench powering and precise measurements.

2) Gather vehicle symptoms and codes (in-vehicle diagnosis)
- Read transmission-related DTCs (P0700 and manufacturer-specific codes, vehicle speed/input speed/solenoid/communication codes). Record live data: input speed, output speed, gear selection, TCM supply voltage, CAN status, solenoid duty cycles, transmission temperature.
- Theory: a TCM reports faults when it detects internal errors, sensor mismatches, or losing comms. DTCs narrow failure domain (sensor wiring vs module electronics vs mechanical solenoid).
- How fix will be validated: cleared codes then re-run live-data tests; fixed electronics will show restored parameters and proper solenoid commands.

3) Verify external wiring and vehicle-side causes before module removal
- Inspect connector for corrosion, bent pins, water ingress, crushed insulation; wiggle-test harness while watching live-data for glitches; check ground(s) and fused power feed(s) for correct voltage under load.
- Measure supply at TCM connector with key on engine off (KOEO) and cranking: battery voltage present, ignition-switched supply present, and grounds <0.1–0.2 Ω.
- Theory: most “TCM faults” are caused by wiring/connector failures. Repairing wiring restores correct voltages/signals so the module no longer reports internal faults.

4) Decide remove-or-not
- If wiring/vehicle-side good but errors persist, remove TCM for bench diagnostics. If vehicle-side intermittent or physical connector damage found, repair harness and retest before module removal.

5) Module removal and visual inspection
- Remove TCM, open enclosure under clean conditions. Inspect PCB for:
- Burnt components, cracked solder joints, lifted traces.
- Swollen or leaky electrolytic capacitors.
- Corrosion (green/white deposits) near connectors.
- Broken/dry joints on power-handling components.
- Theory: power surges, thermal cycling, water ingress and cracked solder commonly cause open/shorts or degraded regulation/drivers. Replacing/repairing them restores circuit integrity.

6) Bench power-up checks (safe, ordered)
- Use current-limited bench supply, connect vehicle connector or bench harness, power module; monitor supply current and voltage rails.
- Measure regulator outputs (e.g., 5V logic rail, 3.3V MCU rail) and check for proper startup sequence. Probe reset and clock pins (oscillator) if visible.
- Theory: MCU and sensors need stable rails and clock to boot. Faulty regulator or caps produce brownouts, corrupt EEPROM or erratic control.

7) Functional signal-level tests
- Check CAN transceiver TX/RX pins with oscilloscope while powering: balanced CAN bus differential signals if connected to vehicle harness (or simulate with bus terminator). If no CAN, check for MCU activity (clock pulses, serial comms).
- Check solenoid driver outputs (MOSFET drains) for shorts to ground: measure resistance from output pins to ground and to supply. Look for burnt FETs or shorted diodes.
- Theory: Shorted driver FET will blow internal fuses, pull power rail low, or keep solenoid energized (stuck gear). Replacing driver restores correct solenoid control.

8) Component-level diagnosis and typical failure modes
- Power stage: check smoothing capacitors (ESR meter), voltage regulators (dropout, heat), transient suppression diodes. Replace low-capacity or high-ESR caps; replace regulators with correct specs.
- Theory: bad caps cause ripple and poor transient response; regulator failure stops MCU or CAN from operating.
- MCU/EEPROM: inspect for visible damage. If MCU unresponsive but power rails OK and oscillator working, suspect MCU or corrupted EEPROM. Replacement often requires reprogramming or module exchange.
- Theory: corrupted firmware or failed MCU prevents decision logic; reflash or replace module returns correct program and calibration.
- CAN transceiver and comms: replace transceiver IC if no bus activity but MCU OK.
- Theory: transceiver converts MCU TTL to CAN physical layer; a failed transceiver breaks comm and causes limp/diagnostic codes.
- Solenoid drivers (MOSFETs/H-bridges) and free-wheel diodes: test for shorts/opens; replace matched MOSFETs and ensure gate resistors and flyback diodes are intact.
- Theory: replacing restores ability to modulate solenoids; stuck solenoid due to shorted MOSFET will be cleared.
- Connector pins and conformal coating: clean corrosion, repair traces, recoat.
- Theory: restores reliable contact and prevents future leakage paths.

9) Repair techniques
- Replace discrete failed components rather than jury-rigging. Use same spec or OEM-equivalent parts (voltage rating, ESR, temp rating).
- Reflow cracked joints, replace electrolytics, replace regulators/transceivers/MOSFETs with correct footprint and heatsinking. Repair burnt traces with jumper wires or copper foil and epoxy.
- If MCU or locked EEPROM suspected and cannot be reprogrammed, module replacement is usually required. If you swap MCU, be aware many modules require manufacturer programming/coding.
- Theory: restoring correct circuit topology and component specs ensures timing, voltage margins, and driver currents behave as designed.

10) Bench functional simulation of transmission
- If possible, use a test jig or simulate solenoid loads with resistive loads; command outputs (if module exposes test interface) to verify solenoid control and observe current draw patterns.
- Check output switching behavior with oscilloscope (PWM frequency, duty cycle) and verify transient suppression.
- Theory: verifies that repaired drivers produce correct control signals under load and that transient protection prevents back-EMF damage.

11) Firmware/coding and security
- If module replaced or MCU reprogrammed, program correct calibration and vehicle ID using factory diagnostic tool. Reset learned transmission adaptations if required.
- Theory: TCM contains gear mapping, shift logic and learned adaptive parameters. Correct coding aligns module logic to vehicle hardware; clearing adaptations removes incorrect learned values from previous faults.

12) Reinstall, reconnect, and vehicle-level verification
- Refit TCM, connect harness, reconnect battery. Clear DTCs, run KOEO and then KOER tests. Use scan tool to command solenoids in diagnostics, monitor live-data: input/output speed correlation, gear selector position, pressure readings, solenoid duty cycles.
- Road test through all gears under varying loads while monitoring for overheating, slipping, or abnormal pressures. Re-check for codes.
- Theory: proper repair restores correct control, so during road test the TCM should produce expected gear shifts, maintain pressures, and not set fault codes.

13) Common repair-to-fault mappings (how fix addresses symptom)
- Intermittent comms/U-codes → fix: repair corroded connector or replace CAN transceiver. Effect: bus restored, TCM regains communication with ECM/ABS and stops defaulting to limp mode.
- No power or brownouts → fix: replace regulator/capacitors/repair traces. Effect: MCU and sensors receive stable voltage, boot reliably, clear spurious faults.
- Stuck solenoid / gear stuck → fix: replace shorted MOSFET or driver components, ensure flyback diodes. Effect: solenoid is no longer permanently energized; normal shift control restored.
- Corrupted memory/firmware errors → fix: reflash or replace TCM and code. Effect: correct shift logic and parameters restored; unpredictable behavior ceases.
- Water/corrosion damage → fix: clean, replace affected components, reseal enclosure. Effect: removes leakage paths and shorts that caused intermittent failures.

14) Final documentation and preventive measures
- Log repairs, replaced parts, software versions, and calibration values. Recommend sealing connectors, applying dielectric grease, and verifying mount location to prevent moisture.
- Theory: preventing ingress and reducing vibration extends module life and prevents recurrence.

Concise expected measurement references (general)
- Battery to ignition-switched feed at TCM: ~12–14 V KOEO.
- Logic rails: typical 5V or 3.3V ±5% (confirm service manual).
- Ground resistance: <0.2 Ω.
- Solenoid driver off-state: high impedance; short to ground indicates failed FET.
- CAN bus idle differential: ~2.5 V centre, ±~1 V swing (check with oscilloscope).

End.
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